AIEV Laser Solutions for Power Electronics
AIEV Laser offers next generation laser scribing solutions in high-voltage, high-temperature, and high-frequency application like advanced AI Semiconductors, and EV applications.
Silicon Carbide (SiC)
SiC can handle higher voltages and faster switching speeds than silicon, making it ideal for high-power, high-temperature, and high-switching frequency applications, and allows for smaller, lighter, and more efficient components.
The challenges are SiC is hard and brittle, requiring high-precision non-contact methods like custom laser scribing technology to avoid material damage during processing.
Ceramics Substrates
Ceramics provide excellent thermal stability and insulation, making them essential for packing high-power devices that generate significant heat.
Ceramics are hard but brittle, prone to cracking during mechanical processing, which require precise and proven laser scribing technologies to avoid damage.
Glass Substrates
Traditional silicon-based integrated circuits (ICs) have long been foundational to the development of power electronics. Still, as the demands on these systems increase in terms of efficiency, power density, and thermal management, several challenges arise. Advancement in laser scribing technology offers innovative solutions to these challenges.
Thermal Management : Silicon has a limited ability to dissipate heat generated during operation. This thermal limitation restricts the power density that can be achieved and impacts the reliability and longevity of the devices.
Switching Speeds and Efficiency: Silicon devices have intrinsic material limitations that affect their switching speeds. Faster switching speeds are desirable in power electronics as they improve efficiency and reduce energy losses but can also lead to increased electromagnetic interference and switching losses.
Material Breakdown at High Voltages: At high voltages, silicon devices are prone to breakdown and other reliability issues. This necessitates the use of more complex designs, such as thicker layers and protective coatings, which can complicate manufacturing processes and increase costs.
Advanced AIEV Laser scribing technology can improve the manufacturing and operational characteristics of the next-generation substrates for advanced power electronics, and effective HAZ management.
Precision Dicing and Scribing: AIEV Lasers can precisely scribe and dice silicon wafers, allowing for the creation of smaller, more tightly packed components. This precision can be crucial for improving the integration density of power circuits.
Benefits: Reduces material waste and enables complex geometries that are difficult to achieve with traditional mechanical cutting methods.
Thermal Isolation and Management: AIEV Laser scribing can be used to create isolation trenches or modify the surface of silicon to improve its thermal properties.
Benefits: Enhanced heat dissipation capabilities by structuring the substrate to facilitate better thermal management, potentially increasing device reliability and performance under high-power conditions.
Creating Low-Resistance Pathways: AIEV Lasers can modify the conductivity pathways within silicon substrates by altering the dopant profiles or creating specific microstructures.
Benefits: Optimizes the efficiency of current flow, potentially reducing resistance and power losses.
AIEV Laser Technology
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Key Requirements for Laser Scribing Technology in High Thermal Semiconductors
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Sic Laser Scribing
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AIEV Laser Scribing
High-precision laser scribing on SiC, Glass, and Ceramic substrates
Automation
Precise, high-speed tasks with minimal human intervention, including cutting, welding, drilling, and marking materials with consistent accuracy
Improved Productivity
Superior precision, minimizing defects and ensuring consistent product quality, boosting productivity.
Cost Efficiency
Faster processing speed, while minimizing material waste through precise cutting and ablation techniques, reducing maintenance costs.
AI and EV Applications
AIEV Laser Solutions
AIEV Laser Scribing
Customized Design to Manufacturing for AI semiconductors and EV Applications
EV Applications
– Laser Precision Automation
AIEV laser scribing enables higher efficiency and performance with increased durability, more efficient power converters, inverters, and battery performance.
Automated Laser Scriber System for SiC, Trisilicon Tetranitride, AIN Ceramics, and Alumina.
Features: Auto loading/unloading, Auto precision X-Y Axis drive, motorized adjustment of focusing axis, laser cooler, dust/collector and AVR, and more.
Modules: Dual Working Station, Robo Pick , Place, Conveyer Unit. High Precision Laser Processing Head with Manual and Auto Loading Capability
Industrial Laser Automation Systems like EV Motors, Auto Parts, Battery, Microelectronics machining, etc.
EV Battery Laser Welder | EV Motors Magnetic Domain Refinement | Transmission Sun gear and Carrier laser welding | Airbag inflator laser welder | ABS solenoid valve |Aluminum detonator laser welder | Spinning wheel laser perforator | Injection Valve Laser Welder…
Unlock the Future of Precision with Custom G3 AIEV Laser Systems.
Contact us for custom AIEV Laser Systems designed specifically to handle the complexities of next-generation substrates like Silicon Carbide (SiC), Gallium Nitride (GaN), ceramics, glass, and synthetic diamond.
Our AIEV laser solutions are built to meet the most demanding high-power, high-temperature, and high-frequency applications, enabling you to produce high-performance components with unmatched accuracy and efficiency with modular design for scalability, such as, Laser Processing Module, Conveyer Supply Module, Laser Cooling Unit, Dust/Fume Collector (Option), and Auto Voltage Regulator.
Improved Quality & Safety | Lower Maintenance Cost.
Improve Core Loss & Production Yields | G3 LMDR
Wafer defects diagnostics | surface treatment
Communication module laser cutting and welding
Ceramic laser perforator and scrubber
Motors, battery, airbag, ABS solenoid value, high-precision parts manufacturing | Improved costs & productivity
LCD platinum platinum laser cutter | Glass surface treatment.
Non-invasive 3D real-time imaging | 10~30 times higher resolution than MRI, PET, CT Scan
Need Help with Innovative Industrial Solutions? Contact Us!
Laser Scribing Solutions | Nest-Generation Substates
Experience The Power of Collaboration
Forging Innovation Together
Our success story isn’t just about groundbreaking technology, it is about harnessing the power of collaboration. From the initial spark of design to the craftmanship of manufacturing, we stand shoulder-to-shoulder with our clients, tackling challenges and forming solutions together.